Our high-density flex circuit applications engineers take your big ideas and make them a reality. We will turn around your standard flex circuit prototype, accelerating your time to market. Together we offer expanded Medical and Test & Measurement capabilities to support your critical and cost-effective performance requirements. Precision laser micromachining and laser drilling to sub 2.5 m tolerance at 15 m feature size.
Deposition of low stress metal alloy and oxide thin films for custom manufacturing and advanced R&D applications. We collaborate with you before and during production to ensure your flex circuit prototype is optimized for manufacturing. Our engineers are experts in quickly fabricating the most challenging flex circuit designs to meet your performance and reliability targets.
We guide you through the build cycle, ensuring that you understand the trade-offs, opportunities, and risks every step of the way. We are known for delivery of high-quality, and in many cases high-complexity, flex circuit prototypes in record time.
Deposition of low stress metal alloy and oxide thin films for custom manufacturing and advanced R&D applications. We collaborate with you before and during production to ensure your flex circuit prototype is optimized for manufacturing. Our engineers are experts in quickly fabricating the most challenging flex circuit designs to meet your performance and reliability targets.
We guide you through the build cycle, ensuring that you understand the trade-offs, opportunities, and risks every step of the way. We are known for delivery of high-quality, and in many cases high-complexity, flex circuit prototypes in record time.
Services
At MicroConnex, we are proud of our reputation as the quickest quick-turn provider of flexible circuit solutions.
We have earned this distinction by pushing the edge of accepted limits and succeeding where others have failed.
Partner with us to solve your toughest design dilemmas.
If you require a fine-pitch flex circuit, laser micromachining services, thin film deposition, or flex circuit manufacturing, we can help.
Discover the competitive advantages of incorporating our smaller, lighter, and more reliable flexible circuit solutions into your products.
We have earned this distinction by pushing the edge of accepted limits and succeeding where others have failed.
Partner with us to solve your toughest design dilemmas.
If you require a fine-pitch flex circuit, laser micromachining services, thin film deposition, or flex circuit manufacturing, we can help.
Discover the competitive advantages of incorporating our smaller, lighter, and more reliable flexible circuit solutions into your products.
MicroConnex was founded by Thomas Clary and Scott Corbett in 1995 as MicroSound Systems, an R&D company exploring complex new designs and manufacturing methods for ultrasound transducers using laser drilling and micromachining.
MicroSound received contracts from DARPA and the US Navy as part of a battlefield imaging emphasis.
This initial funding enabled the purchase of our first laser system, the ESI 5100.
Alongside the ultrasound transducer effort, we began developing the technology and expertise to make dense flexible circuits.
MicroSound received contracts from DARPA and the US Navy as part of a battlefield imaging emphasis.
This initial funding enabled the purchase of our first laser system, the ESI 5100.
Alongside the ultrasound transducer effort, we began developing the technology and expertise to make dense flexible circuits.
Your Total Solution for Flex Prototypes, Laser Micromachining, and Thin Film Deposition That Scale to Manufacturing.
We are best known for our highly creative and imaginative team of flex circuit engineers who can produce your multilayer, high-density (1 mil trace/space) flex prototype in 15 days or less.
Because we produce and manufacture flex circuits at our ISO 9001-certified, US facility, you work with one company from start to finish!
Use our core services in any combination.
Our specialties are quick turn flex prototypes and manufacturing of complex flex circuits.
We are best known for our highly creative and imaginative team of flex circuit engineers who can produce your multilayer, high-density (1 mil trace/space) flex prototype in 15 days or less.
Because we produce and manufacture flex circuits at our ISO 9001-certified, US facility, you work with one company from start to finish!
Use our core services in any combination.
Our specialties are quick turn flex prototypes and manufacturing of complex flex circuits.
As a cutting-edge flex circuit manufacturer, our experience and capabilities can give your design a competitive advantage.
We fabricate to your specifications while contributing DFM and integration expertise on HDI flex circuits, laser drilling, and cutting on thin materials.
MicroConnex operates within the ISO 9001 framework to ensure quality and consistency from proto to manufacturing.
Few flex circuit manufacturers can match our capabilities and responsiveness, and even fewer encourage and welcome innovative designs that cut across categories and/or push the limits of typical IPC standards.
We fabricate to your specifications while contributing DFM and integration expertise on HDI flex circuits, laser drilling, and cutting on thin materials.
MicroConnex operates within the ISO 9001 framework to ensure quality and consistency from proto to manufacturing.
Few flex circuit manufacturers can match our capabilities and responsiveness, and even fewer encourage and welcome innovative designs that cut across categories and/or push the limits of typical IPC standards.
Our technical teams can produce your standard flex prototype in 5 days and developmental flex prototype in 15 days.
Challenge us with multilayer, sub 2-mil thickness, tight registration, and a high number of traces.
Give us your toughest HDI with a specific RF performance requirement.
Ask us to make your flex circuits smaller, lighter, and more reliable.
Our in-house manufacturing capabilities make us the ultimate production partner for mid-volume complex flex circuits.
Because flexible circuits use the thinnest dielectric substrates available for making electronic interconnections, it's possible to produce flex circuits with a total thickness approaching 1 mil (25 m), including a protective cover layer.
Challenge us with multilayer, sub 2-mil thickness, tight registration, and a high number of traces.
Give us your toughest HDI with a specific RF performance requirement.
Ask us to make your flex circuits smaller, lighter, and more reliable.
Our in-house manufacturing capabilities make us the ultimate production partner for mid-volume complex flex circuits.
Because flexible circuits use the thinnest dielectric substrates available for making electronic interconnections, it's possible to produce flex circuits with a total thickness approaching 1 mil (25 m), including a protective cover layer.
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